TITLE: DRY ETCH PROCESS DEVELOPMENT ENGINEER
FLSA STATUS: EXEMPT
REPORTS TO: SR. MANAGER, DRY ETCH PROCESS DEVELOPMENT
SUMMARY:
Under the direction of the Sr. Manager Dry Etch Process Development, the Dry Etch Process Development Engineer is responsible for the developing and implementing new dry etch processes (RIE, IBE, ashing, etc.) for next generation magnetic recording heads, including designing and conducting wafer experiments, analyzing the data, and reporting the results; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:
- Develops and implements new dry/plasma etch processes (RIE, IBE, ashing, etc.), for next generation magnetic recording heads
- Reviews characterization data from FIB, SEM, and TEM to conduct root cause analysis and recommend corrective action
- Implements new process control schemes or methodologies which ensure product manufacturability
- Develops and implements practices or methodologies which reduce cost and improve operational efficiency
- Develops and implements processes or procedures for transitioning new products into the production line
- Reviews, updates, and maintains documentation and process instructions
- Interacts with suppliers and vendors to ensure that appropriate materials or supplies are readily available for line use
- Instructs operators and technicians on processes and procedures, including modifications to existing procedures
- Partners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production line
- Designs and conducts experiments, analyzes data, and develops recommendations for improving the performance or reducing cost based on test results
- Partners with other groups and departments, including process and product engineering to develop and implement new processes which reduce scrap and improve yield
- Responds to inquiries from other team members, managers, or departments
- Adheres to all safety policies and procedures as required
MINIMUM QUALIFICATIONS:
- Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master’s degree preferred
- Three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process Engineer
- Experience in plasma etch process development (RIE, IBE, ashing, etc.) is preferred
- Experience working in a wafer fab manufacturing environment
- Experience with Statistical Process Control (SPC)
- Proficient in the use of Microsoft Office Applications
Knowledge, Skills, and Abilities:
- Knowledge of semiconductor or HDD industry principles, practices, and techniques
- Knowledge of wafer fabrication processing techniques, including process development and integration practices
- Knowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniques
- Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure
- Knowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate action
- Knowledge and ability to use Microsoft Office applications to create reports and presentations
- Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
- Able to work productively and collaboratively with all levels of employees and management
- Able to comply with all safety policies and procedures
- Demonstrated organizational and time management skills
- Demonstrated problem-solving and trouble shooting skills
- Flexible and able to prioritize
The annual base salary for this full-time position is between $96,655.20-$163,641.25 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:
The Dry Etch Process Development Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.