As a Semiconductor Failure Analysis Engineering Technician, you will,
- Work with a group of senior electrical analysts and contribute to product analysis in support of new product introduction (NPI), product qualification, yield enhancement and customer quality complaints.
- Perform various tasks that involve preparing a semiconductor device for analysis including CNC milling and polishing silicon; using grinding and chemical etching to extract semiconductor die from their package; and milling portions of packages away to expose the semiconductor die.
- Perform wirebonding to connect a semiconductor die to a package substrate.
- Perform physical analysis tasks including delayering of semiconductor devices by Reactive Ion Etching (RIE)/chemical etching/physical polishing, and inspections utilizing optical microscopes and Scanning Electron Microscopes
- Perform electrical measurements on semiconductor devices using current/voltage curve tracing.
Minimum requirements:
- Two- or four-year degree in Semiconductor Technology, Electrical Engineering Technology, Mechanical Engineering Technology, Chemical Engineering Technology, Physics, Chemistry or equivalent
- Knowledge of Semiconductor Integrated Circuit processing steps is an advantage.
- Laboratory experience is a plus.
- Good written and verbal communication skills.
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.